Flexible vacuum-packaging method for resonating micromachines

被引：24

作者：

Sparks, DR

Jordan, L

Frazee, JH

机构：

[1] Delco Electronics Corp., Kokomo

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1996年 / 55卷 / 2-3期

关键词：

micromachines; resonance; vacuum packaging;

D O I：

10.1016/S0924-4247(97)80076-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The vacuum packaging of resonant micromachined sensors using a solder reflow or brazing technique is disclosed. Various packaging processes, such as die adhesive selection and processing, solder selection and reflow temperature are experimentally treated with respect to the Q-value obtained by both cantilever- and ring-shaped micromachines. The stability of nickel micromachines under low-amplitude resonant conditions is demonstrated using this packaging technique. The advantages of this packaging method for development and low-volume production devices are presented.

引用

页码：179 / 183

页数：5

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