The influences of transverse loads on electrothermal post-buckling microbeams

被引:11
作者
Chen, Xing [1 ,2 ]
Ma, LianSheng [1 ,2 ,3 ]
Zheng, YingMei [1 ,2 ]
Li, Xinxin [4 ,5 ]
Lee, Dong-Weon [1 ,2 ]
机构
[1] Chonnam Natl Univ, Sch Mech Syst Engn, MEMS, Kwangju, South Korea
[2] Chonnam Natl Univ, Sch Mech Syst Engn, Nanotechnol Lab, Kwangju, South Korea
[3] Lanzhou Univ Technol, Sch Sci, Lanzhou, Peoples R China
[4] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai, Peoples R China
[5] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Sci & Technol Microsyst Lab, Shanghai, Peoples R China
关键词
DRIVEN ELECTROMAGNETIC MICROACTUATOR; OPTICAL SWITCH; BEAM ACTUATORS; MICROSTRUCTURES; OPTIMIZATION; DELAMINATION; SUBSTRATE;
D O I
10.1088/0960-1317/22/1/015011
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];
摘要
We report on a nonlinear equation-based closed-form solution for a spring-loading-enclosed electrothermal post-buckling microbeam that expresses (a) the relation between the compressive loads and its corresponding lateral deflections and (b) the threshold loads required to trigger the buckling phenomenon, under the condition of a variety of transverse loads. Our theoretical research reveals that the post-buckling behavior varies considerably under different transverse load ranges. Three types of double-clamped microbeams connected to microsprings with different dimensions and compliances representing transverse loads were fabricated and measured using microelectromechanical systems (MEMS) technology. Excellent agreement was found between our theoretical analysis and experimental results to confirm our exact solutions. It proves that the influences on thermal post-buckling behavior are dependent on different microbeam dimensions and microspring compliances (i.e., transverse loads). Therefore, an electrothermal buckling/post-buckling beam under external transverse loads can be accurately predicted using our theoretical model, which can be applied to either existing microdevices that are based on similar principles or other potential applications.
引用
收藏
页数:7
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