An integrated LTCC laminated waveguide-to-microstrip line T-junction

被引：26

作者：

Huang, Y ^{[1
]}

Wu, KL

Ehlert, M

机构：

[1] Chinese Univ Hong Kong, Dept Elect Engn, Shatin, Hong Kong, Peoples R China

[2] Natl Semicond Corp, LTCC Div, Irvine, CA 92618 USA

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2003年 / 13卷 / 08期

关键词：

laminated waveguide; low-temperature co-fired ceramic (LTCC); microstrip line; T-junction; transition;

D O I：

10.1109/LMWC.2003.815690

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, an integrated low-temperature co-fired ceramic (LTCC) laminated waveguide to microstrip line T-junction is proposed and experimentally verified. A multilayer bell- shape probe end comprising multiple parallel metallic pads is used to improve the bandwidth and matching condition. The experimental result shows good correlation with the simulated result. The configuration can also be used as the transition between microstrip line and laminated waveguide.

引用

页码：338 / 339

页数：2

共 7 条

[1] DESIGN OF SIMPLE BROAD-BAND WAVE-GUIDE-TO-COAXIAL-LINE JUNCTIONS [J].

COHN, SB .

PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1947, 35 (09) :920-926

[2] Integrated microstrip and rectangular waveguide in planar form [J].

Deslandes, D ;

Wu, K .

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2001, 11 (02) :68-70

[3]

Holzwarth S, 2001, IEE CONF PUBL, P710, DOI 10.1049/cp:20010383

[4] A broad-band LTCC integrated transition of laminated waveguide to air-filled waveguide for millimeter-wave applications [J].

Huang, Y ;

Wu, KL .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (05) :1613-1617

[5] Development of planar antennas in multi-layer packages for RF-system-on-a-package applications [J].

Lim, K ;

Obatoyinbo, A ;

Davis, M ;

Laskar, J ;

Tummala, R .

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, :101-104

[6] Development of a "laminated waveguide" [J].

Uchimura, H ;

Takenoshita, T ;

Fujii, M .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (12) :2438-2443

[7]

Uchimura H, 1999, IEEE MTT-S, P453, DOI 10.1109/MWSYM.1999.779800

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