Hexagonal microlens array modeling and fabrication using a thermal reflow process

被引:113
作者
Lin, CP [1 ]
Yang, HS
Chao, CK
机构
[1] Natl Taiwan Univ Sci & Technol, Dept Mech Engn, Taipei 106, Taiwan
[2] Natl Chung Hsing Univ, Inst Precis Engn, Taichung 402, Taiwan
关键词
D O I
10.1088/0960-1317/13/5/333
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A mathematical model for designing and fabricating a hexagonal microlens array using a thermal reflow process was developed in this study. The experimental results proved that a hexagonal microlens array could be produced without a gap at each microlens periphery. A hexagonal microlens array with a higher fill factor was successfully produced. In this experiment, hexagonal photoresist columns were formed onto a silicon substrate made using a lithographic process. The hexagonal pattern was laid out in an ortho-triangle on a PET (polyethylene terephthalate)-based mask. Using precise temperature and time control during the thermal reflow process, a hexagonal microlens array with lateral honeycomb geometry was formed from the melted photoresist flowing outward simultaneously and uniformly. The surface tension effect transformed the photoresist column surface into a spherical profile. The error in the fabricated microlens characteristics was within +/-3% between two theoretical models used to predict the photoresist column thickness and actual thickness. This model is feasible for fabricating various sized hexagonal microlens arrays.
引用
收藏
页码:775 / 781
页数:7
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