Advances in experimental technique for quantitative two-dimensional dopant profiling by scanning capacitance microscopy

被引:93
作者
Zavyalov, VV [1 ]
McMurray, JS [1 ]
Williams, CC [1 ]
机构
[1] Univ Utah, Dept Phys, Salt Lake City, UT 84112 USA
关键词
D O I
10.1063/1.1149558
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Several advances have been made toward the achievement of quantitative two-dimensional dopant and carrier profiling. To improve the dielectric and charge properties of the oxide-silicon interface, a method of low temperature heat treatment has been developed which produces an insulating layer with consistent quality and reproducibility. After a standard polishing procedure is applied to cross-sectional samples, the samples are heated to 300 degrees C for 30 min under ultraviolet illumination. This additional surface treatment dramatically improves dielectric layer uniformity, scanning capacitance microscopy (SCM) signal to noise ratio, and C-V curve flat band offset. Examples of the improvement in the surface quality and comparisons of converted SCM data with secondary ion mass spectrometry (SIMS) data are shown. A SCM tip study has also been performed that indicates significant tip depletion problems can occur. It is shown that doped silicon tips are often depleted by the applied SCM bias voltage causing errors in the SCM measured profile. Worn metal coated and silicided silicon tips also can cause similar problems. When these effects are tested for and eliminated, excellent agreement can be achieved between quantitative SCM profiles and SIMS data over a five-decade range of dopant density using a proper physical model. The impact of the tip size and shape on SCM spatial accuracy is simulated. A flat tip model gives a good agreement with experimental data. It is found that the dc offset used to compensate the C-V curve flat band shift has a consistently opposite sign on p- and n-type substrates. This corresponds to a positive surface on p- type silicon and to a negative surface on n-type silicon. Rectification of the large capacitance probing voltage is considered as a mechanism responsible for the apparent flat band shift of (0.4-1) V measured on the samples after heating under UV irradiation. To explain the larger flat band shift of (1-5) V, tip induced charging of water-related traps is proposed and discussed. (C) 1999 American Institute of Physics. [S0034-6748(99)03001-4].
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收藏
页码:158 / 164
页数:7
相关论文
共 22 条
[1]  
[Anonymous], COMMUNICATION
[2]   Direct extraction of the electron tunneling effective mass in ultrathin SiO2 [J].
Brar, B ;
Wilk, GD ;
Seabaugh, AC .
APPLIED PHYSICS LETTERS, 1996, 69 (18) :2728-2730
[3]   Characterization of two-dimensional dopant profiles: Status and review [J].
Diebold, AC ;
Kump, MR ;
Kopanski, JJ ;
Seiler, DG .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (01) :196-201
[4]   Scanning capacitance spectroscopy: An analytical technique for pn-junction delineation in Si devices [J].
Edwards, H ;
McGlothlin, R ;
San Martin, R ;
U, E ;
Gribelyuk, M ;
Mahaffy, R ;
Shih, CK ;
List, RS ;
Ukraintsev, VA .
APPLIED PHYSICS LETTERS, 1998, 72 (06) :698-700
[5]   Quantitative two-dimensional dopant profiling of abrupt dopant profiles by cross-sectional scanning capacitance microscopy [J].
Huang, Y ;
Williams, CC ;
Wendman, MA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1996, 14 (03) :1168-1171
[6]   INTERFACE STATES IN MOS STRUCTURES WITH 20-40 A THICK SIO2 FILMS ON NONDEGENERATE SI [J].
KAR, S ;
DAHLKE, WE .
SOLID-STATE ELECTRONICS, 1972, 15 (02) :221-+
[7]  
KEIMAN RN, 1995, INT EL DEV M, P691
[8]   Scanning capacitance microscopy applied to two-dimensional dopant profiling of semiconductors [J].
Kopanski, JJ ;
Marchiando, JF ;
Lowney, JR .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1997, 44 (1-3) :46-51
[9]   Kinetics of field-induced oxidation of hydrogen-terminated Si(111) by means of a scanning force microscope [J].
Ley, L ;
Teuschler, T ;
Mahr, K ;
Miyazaki, S ;
Hundhausen, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (04) :2845-2849
[10]  
MARCHIANDO JF, 1997, P 4 INT WORKSH MEAS