Thermoelectric figure of merit of metal-semiconductor barrier structure based on energy relaxation length

被引:65
作者
Moyzhes, B [1 ]
Nemchinsky, V
机构
[1] Stanford Univ, Dept Appl Phys, Stanford, CA 94305 USA
[2] ESAB Welding & Cutting Prod, Florence, SC 29501 USA
关键词
D O I
10.1063/1.122318
中图分类号
O59 [应用物理学];
学科分类号
摘要
The thermoelectric figure of merit is calculated for a compound material comprising thin semiconductor and wider metallic layers. The layers are perpendicular to the direction of current. The semiconductor barriers exclude electrons with energies epsilon < mu from the current. This exclusion increases thermopower. One may obtain a material with a very high ZT if the distance between the barriers is on the order of the energy relaxation length. This material should have the resistivity characteristic of a metal and the thermopower characteristic of a semiconductor. An additional significant rise in ZT can be achieved by increasing the contact area at the metal-semiconductor interface. (C) 1998 American Institute of Physics. [S0003-6951(98)04339-3].
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页码:1895 / 1897
页数:3
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