Plastic deformation of nanocrystalline Cu and Cu-0.2 wt.% B

被引：59

作者：

Iyer, RS

Frey, CA

Sastry, SML

Waller, BE

Buhro, WE

机构：

[1] Washington Univ, Mat Sci & Engn Program, St Louis, MO 63130 USA

[2] Washington Univ, Dept Chem, St Louis, MO 63130 USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1999年 / 264卷 / 1-2期

关键词：

nanocrystalline; copper; boron; hardness; strength; plastic deformation; recovery; recrystallization; heat treatment;

D O I：

10.1016/S0921-5093(98)01027-2

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Plastic deformation behavior of nanocrystalline copper with and without trace boron was studied. Fully dense defect-free compacts were produced and mechanical properties were measured. The Hall-Fetch (H-P) relationship was followed down to the 25 nm. smallest grain size investigated. The H-P slopes were smaller in nanocrystalline copper than in conventional copper. The role of boron in altering grain growth, strain hardening, recovery, and recrystallization was investigated by comparison of results in nanocrystalline copper with and without trace boron. (C) 1999 Published by Elsevier Science S.A. All rights reserved.

引用

页码：210 / 214

页数：5

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