Thermal stress analysis/life prediction of concentrating photovoltaic module

Aiming at understanding the structural integrity of two representative concentrating photovoltaic (CPV) module configurations, finite element thermal stress analysis is carried out in this investigation. This study covers the nominal and extreme operating conditions, including system startup and shutdown. While the first CPV module is bonded by epoxy-type material, the bonding material for the second CPV module is lead-free solder The analysis of the first module confirms that this CPV module can endure the thermal stress under steady-state operation. However residual stress analysis shows that the epoxy holding together the PV cell/aluminum nitride and aluminum nitride/heat sink pairs will likely break, first at some sporadic spots, and then in a good part of the bond causing the failure of the CPV module, as the cell temperature drops from 100 degrees C to 0 degrees C. Nonlinear viscoplastic analysis using the temperature profile of CPV cell fatigue test ongoing at United Technologies Research Center (UTRC) is performed to evaluate the structure strength and subsequently predict the life of the second CPV module. The result reveals that the maximum characteristic stresses of the PV cell components and heat sink are below the strength allowable for the corresponding materials under both the steady-state and overnight idle conditions. Critical locations on the solder that are potentially susceptible to structural failure after a few thousand thermal cycles due to the excessive shear stress are identified. A rough estimation of the module life is provided and compared with the fatigue test. This investigation provides firsthand understanding of the structural integrity of CPV modules and is thus beneficial for the solar energy community.