A method for tightly coupled thermal-electrical simulation

被引：13

作者：

Klaassen, B

机构：

[1] GMD-SET Institute

来源：

MICROELECTRONICS JOURNAL | 1997年 / 28卷 / 03期

关键词：

D O I：

10.1016/S0026-2692(96)00028-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

A method is presented to combine analogue simulators (like SPICE) with device simulators (like ANSYS), for thermal-electrical analysis of integrated circuits or systems. A sketch of a first prototype program is given together with the theoretical background, which makes use of convergence principles from waveform relaxation. It follows a short review of related work. Our approach can also be extended to more general problems occurring in microsystems simulation. (C) 1997 Elsevier Science Ltd.

引用

页码：239 / 245

页数：7