Performance analysis of 10-μm-thick VCSEL array in fully embedded board level guided-wave optoelectronic interconnects

被引：16

作者：

Choi, C ^{[1
]}

Lin, L ^{[1
]}

Liu, YJ ^{[1
]}

Chen, RT ^{[1
]}

机构：

[1] Univ Texas, Dept Elect & Comp Engn, Austin, TX 78758 USA

来源：

JOURNAL OF LIGHTWAVE TECHNOLOGY | 2003年 / 21卷 / 06期

关键词：

embedded optical interconnects; PCB; substrate removal; thermal resistance; VCSEL;

D O I：

10.1109/JLT.2003.812162

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We introduce a simple and effective heat sink structure for thin-film vertical cavity surface emitting lasers (VCSELs) in fully embedded board level guided-wave interconnects. A 50% quantum efficiency increase is experimentally confirmed for the 10-mum thin-film VCSELs. The thermal resistance of a 1 x 11 embedded thin-film VCSEL array in printed circuit board (PCB) is further analyzed. The experimental results show an excellent match with the simulated results. The 10-mum-thick VCSEL had the lowest thermal resistance and the highest differential efficiency compared to 250-, 200-, 150-, and 100-mum-thick VCSELs. A substrate removed VCSEL can be used in fully embedded board level optical interconnects without special cooling techniques.

引用

页码：1531 / 1535

页数：5

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