Reaction-diffusion model for thermal growth of silicon nitride films on Si

被引:16
作者
de Almeida, RMC [1 ]
Baumvol, IJR [1 ]
机构
[1] Univ Fed Rio Grande do Sul, Inst Fis, BR-91501970 Porto Alegre, RS, Brazil
关键词
D O I
10.1103/PhysRevB.62.R16255
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermal growth of ultrathin silicon nitride films on Si in NH3 is modeled as a dynamic system governed by reaction-diffusion equations. Solution of the model yields profiles of the involved species consistent with experimental observations of a stoichiometric silicon nitride layer in the near-surface region and a subnitride layer of comparable thickness in the near-interface region. Self-limited growth kinetics are also obtained from the model equations in good agreement with experimental results, owing to a diffusion barrier layer to the nitridant species formed in the near-surface region by stoichiometric silicon nitride.
引用
收藏
页码:R16255 / R16258
页数:4
相关论文
共 31 条
[1]   Effect of thermal stability and roughness on electrical properties of tantalum oxide gates [J].
Alers, GB ;
Stirling, LA ;
Vandover, RB ;
Chang, JP ;
Werder, DJ ;
Urdahl, R ;
Rajopalan, R .
ULTRATHIN SIO2 AND HIGH-K MATERIALS FOR ULSI GATE DIELECTRICS, 1999, 567 :391-395
[2]   Dislocation emission at the silicon/silicon nitride interface:: A million atom molecular dynamics simulation on parallel computers [J].
Bachlechner, ME ;
Omeltchenko, A ;
Nakano, A ;
Kalia, RK ;
Vashishta, P ;
Ebbsjö, I ;
Madhukar, A .
PHYSICAL REVIEW LETTERS, 2000, 84 (02) :322-325
[3]   Atomic transport during growth of ultrathin dielectrics on silicon [J].
Baumvol, IJR .
SURFACE SCIENCE REPORTS, 1999, 36 (1-8) :1-166
[4]   MECHANISMS OF THERMAL NITRIDATION OF SILICON [J].
BAUMVOL, IJR ;
STEDILE, FC ;
GANEM, JJ ;
RIGO, S ;
TRIMAILLE, I .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (04) :1205-1214
[5]   Isotopic tracing of Si during thermal growth of Si3N4 ultrathin films [J].
Baumvol, IJR ;
Borucki, L ;
Chaumont, J ;
Ganem, JJ ;
Kaytasov, O ;
Piel, N ;
Rigo, S ;
Schulte, WH ;
Stedile, FC ;
Trimaille, I .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1996, 118 (1-4) :499-504
[6]   USE OF MULTILAYER TECHNIQUES FOR XPS IDENTIFICATION OF VARIOUS NITROGEN ENVIRONMENTS IN THE SI/NH3 SYSTEM [J].
BISCHOFF, JL ;
LUTZ, F ;
BOLMONT, D ;
KUBLER, L .
SURFACE SCIENCE, 1991, 251 :170-174
[7]   REACTION OF SI(100) WITH NH3 - RATE-LIMITING STEPS AND REACTIVITY ENHANCEMENT VIA ELECTRONIC EXCITATION [J].
BOZSO, F ;
AVOURIS, P .
PHYSICAL REVIEW LETTERS, 1986, 57 (09) :1185-1188
[8]   Scaling the gate dielectric: Materials, integration, and reliability [J].
Buchanan, DA .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1999, 43 (03) :245-264
[9]   Tantalum pentoxide (Ta2O5) thin films for advanced dielectric applications [J].
Chaneliere, C ;
Autran, JL ;
Devine, RAB ;
Balland, B .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 1998, 22 (06) :269-322
[10]   SILICON BACKBOND STRAIN EFFECTS ON NH3 SURFACE-CHEMISTRY - SI(111)-(7X7) COMPARED TO SI(100)-(2X1) [J].
CHEN, PJ ;
COLAIANNI, ML ;
YATES, JT .
SURFACE SCIENCE, 1992, 274 (03) :L605-L610