Low-cost microoptical modules for MCM level optical interconnections

被引:50
作者
Debaes, C
Vervaeke, M
Baukens, V
Ottevaere, H
Vynck, P
Tuteleers, P
Volckaerts, B
Meeus, W
Brunfaut, M
Van Campenhout, J
Hermanne, A
Thienpont, H
机构
[1] Free Univ Brussels, Dept Appl Phys & Photon, B-1050 Brussels, Belgium
[2] Univ Ghent, Dept Elect & Informat Syst, B-9000 Ghent, Belgium
关键词
deep proton lithography; optical interconnections; microoptics; OE-VLSI; VCSELS;
D O I
10.1109/JSTQE.2003.813316
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A multichannel free-space microoptical module for dense MCM-level optical interconnections has been designed and fabricated. Extensive modeling proves that the module is scalable with a potential for multi-Tb/s(.)cm(2) aggregate bit rate capacity while alignment and fabrication tolerances are compatible with present-day mass replication techniques. The microoptical module is an assembly of refractive lenslet-arrays and a high-quality microprism. Both components are prototyped using deep lithography with protons and are monolithically integrated using a vacuum casting replication technique. The resulting 16-channel high optical-grade plastic module shows optical transfer efficiencies of 46% and inter-channel cross talks as low as -22 dB, sufficient to establish workable multichannel MCM-level interconnections. This microoptical module was used in a feasibility demonstrator to establish intra-chip optical interconnections on a 0.6 mum CMOS optoelectronic field programmable gate array. This optoelectronic chip combines fully functional digital logic, driver and receiver circuitry and flip-chipped VCSEL and detector arrays. With this test-vehicle multichannel on-chip data-communication has been achieved for the first time to our knowledge. The bit rate per channel was limited to 10 Mb/s because of the limited speed of the chip tester.
引用
收藏
页码:518 / 530
页数:13
相关论文
共 27 条
[1]  
Becker E. W., 1986, Microelectronic Engineering, V4, P35, DOI 10.1016/0167-9317(86)90004-3
[2]   Microcavity LED-based parallel data link using small-diameter (125 μm) plastic optical fibres [J].
Bockstaele, R ;
Van Hove, A ;
Coosemans, T ;
Sys, C ;
Moerman, I ;
Dhoedt, B ;
Baets, R ;
Van Daele, P ;
Van Koetsem, J ;
Van der Torren, L .
JOURNAL OF OPTICS A-PURE AND APPLIED OPTICS, 1999, 1 (02) :233-236
[3]  
BRUNFAUT M, 1999, P IEEE LAS EL OPT SO, V2, P625
[4]  
BRUNFAUT M, 2001, P SPIE 0629, P160
[5]   COMPARISON BETWEEN OPTICAL AND ELECTRICAL INTERCONNECTS BASED ON POWER AND SPEED CONSIDERATIONS [J].
FELDMAN, MR ;
ESENER, SC ;
GUEST, CC ;
LEE, SH .
APPLIED OPTICS, 1988, 27 (09) :1742-1751
[6]  
FUKUDA M, 1998, OPTICAL SEMICONDUCTO, pCH6
[7]  
GUENTHER AH, 2002, INT TRENDS APPL OPTI, pCH7
[8]   Description and evaluation of the FAST-Net smart pixel-based optical interconnection prototype [J].
Haney, MW ;
Christensen, MP ;
Milojkovic, P ;
Fokken, GJ ;
Vickberg, M ;
Gilbert, BK ;
Rieve, J ;
Ekman, J ;
Chandramani, P ;
Kiamilev, F .
PROCEEDINGS OF THE IEEE, 2000, 88 (06) :819-828
[9]  
Hinton H. S., 1993, An Introduction to Photonic Switching Fabric
[10]   Crosstalk and interconnection distance considerations for board-to-board optical interconnects using 2-D VCSEL and microlens array [J].
Kim, G ;
Han, XL ;
Chen, RT .
IEEE PHOTONICS TECHNOLOGY LETTERS, 2000, 12 (06) :743-745