Two-dimensionally ordered copper grid patterns prepared via electroless deposition using a colloidal-crystal film as the template

Two-dimensionally ordered copper grid patterns with different pore sizes and thickness have been fabricated via electroless copper deposition using a colloidal-crystal film as the template. The pore size of the grid can be adjusted by altering the deposition time. The copper films, with thicknesses of approximate to 100-130 nm and pore sizes of approximate to 100 nm, are flexible and can be peeled off a silicon wafer and rolled up into a reel. Three-dimensionally ordered porous copper materials have also been prepared using a similar method.