Bond graph approach as analysis tool in thermofluid model library conception

被引：58

作者：

Bouamama, BO ^{[1
]}

机构：

[1] Univ Sci & Tech Lille Flandres Artois, Cite Sci LAIL, UPRESA CNRS 8021, F-59655 Villeneuve Dascq, France

来源：

JOURNAL OF THE FRANKLIN INSTITUTE-ENGINEERING AND APPLIED MATHEMATICS | 2003年 / 340卷 / 01期

关键词：

bond graph; model library; steam generator; thermofluid; causality;

D O I：

10.1016/S0016-0032(02)00051-0

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The bond graph is a modelling and simulation tool, providing many possibilities. A methodology based on causal and behavioral bond graph analysis to build a dynamic icon model library in continuous thermofluid process is presented. The developed approach is implemented using SYMBOLS software and applied to a complex steam generator installation. The methodology given as assistant tool, is proposed so that the industrial designer can easily build a thermofluid model of most technological processes. (C) 2003 The Franklin Institute. Published by Elsevier Science Ltd. All rights reserved.

引用

页码：1 / 23

页数：23

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