3D OptoElectronic Stacked Processors: design and analysis

被引：9

作者：

Esener, S ^{[1
]}

Marchand, P ^{[1
]}

机构：

[1] Univ Calif San Diego, Dept Elect & Comp Engn, La Jolla, CA 92093 USA

来源：

OPTICS IN COMPUTING 98 | 1998年 / 3490卷

关键词：

D O I：

10.1117/12.308872

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

We present the design and analysis of a 3D OptoElectronic Stacked Processor System. This system is aimed at combining stacked VLSI chips with free-space optoelectronic Inputs and Outputs for optimal power*volume/throughput balance. Challenges in such systems include finding appropriate thermal extraction schemes, packaging and alignment of the multiple stacks, and appropriate microoptical and optoelectronic component design.

引用

页码：541 / 545

页数：3