Single poly EEPROM for smart power IC's

被引:7
作者
Carman, E [1 ]
Parris, P [1 ]
Chaffai, H [1 ]
Cotdeloup, F [1 ]
Debortoli, S [1 ]
Hemon, E [1 ]
Lin-Kwang, J [1 ]
Perat, O [1 ]
Sicard, T [1 ]
机构
[1] Motorola Inc, Geneva, Switzerland
来源
12TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS - PROCEEDINGS | 2000年
关键词
EEPROM; single poly EEPROM;
D O I
10.1109/ISPSD.2000.856800
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Smart power integrated circuits need low density memory for applications such as trimming, IC customization, system addresses, and part traceability with few program/erase cycles. Memory solutions must be low cost and demonstrate high reliability in automotive environments. Programmability in the application is an advantage. We have developed a single poly EEPROM that meets these requirements and in addition gives significant die area savings over traditional low cost memory techniques.
引用
收藏
页码:177 / 179
页数:3
相关论文
共 5 条
[1]  
ADAM, IEEE 1995 CUST INT C
[2]  
EITAN B, 1987, Patent No. 4649520
[3]  
MINHWA, 1997, NEW SINGLE POLY FLAS
[4]  
PARRIS P, 1999, Patent No. 5929478
[5]  
SOLOMON P, IEEE 1997 NONVOLATIL