Comparison between the thermal and microwave curing of bismaleimide resin

被引:33
作者
Zainol, I
Day, R
Heatley, F
机构
[1] Adv Mat Res Ctr, SIRIM Berhad, Kulim 09000, Kedah, Malaysia
[2] Univ Manchester, Manchester Mat Sci Ctr, Manchester M1 7HS, Lancs, England
[3] Univ Manchester, Dept Chem, Manchester M13 9PL, Lancs, England
关键词
D O I
10.1002/app.12933
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Microwave energy was used to cure Matrimid 5292A bismaleimide resin. The degree of cure at different cure times was determined with differential scanning calorimetry. A comparison was made with the same resin cured in a conventional oven. The resin cured faster in the microwave oven than in the conventional oven. The glass-transition temperature (T-g) depended on the degree of cure. The samples cured with a conventional oven showed slightly higher T-g's than the microwave-cured samples at higher degrees of cure. At low degrees of cure, the two heating methods yielded materials with similar T-g's. Fourier transform infrared spectroscopy and solid-state cross-polarity/magic-angle-spinning C-13 NMR spectroscopy were used to investigate the cured structures. There was no difference in the chemical reactions taking place during the microwave cure and the thermal cure. (C) 2003 Wiley Periodicals, Inc.
引用
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页码:2764 / 2774
页数:11
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