Reversible Soft-Contact Lamination and Delamination for Non-Invasive Fabrication and Characterization of Bulk-Heterojunction and Bilayer Organic Solar Cells

被引:36
作者
Kim, Jong Bok [1 ]
Lee, Stephanie [1 ]
Toney, Michael F. [2 ]
Chen, Zhihua [3 ]
Facchetti, Antonio [3 ]
Kim, Youn Sang [4 ]
Loo, Yueh-Lin [1 ]
机构
[1] Princeton Univ, Dept Chem & Biol Engn, Princeton, NJ 08544 USA
[2] SLAC Natl Accelerator Lab, Stanford Synchrotron Radiat Lightsource, Menlo Pk, CA 94025 USA
[3] Polyera Corp, Skokie, IL 60077 USA
[4] Seoul Natl Univ, Grad Sch Convergence Sci & Technol, Dept Nano Sci & Technol, Seoul 151742, South Korea
基金
美国国家科学基金会;
关键词
PHOTOVOLTAIC DEVICES; POLYMER; EFFICIENCY; PERFORMANCE; TRANSISTORS; DIODES; MORPHOLOGY; MOBILITY; OXIDE;
D O I
10.1021/cm101692a
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Soft-contact lamination (ScL) provides a means to non-invasively establish electrical contact in organic solar cells. In contrast to the typical bottom-up fabrication approaches wherein active components are deposited sequentially in a layer-by-layer fashion, ScL allows individual functional layers to be separately deposited and optimized before these isolated components are brought together to complete the devices. Lamination and delamination of top electrodes to and from the active layer, respectively, are reversible and thus enables the characterization of the once-buried active layer after device processing and testing. ScL also enables the fabrication and characterization of bilayer organic solar cells comprising electron donors and electron acceptors that have comparable solubilities, the fabrication of which would not have been possible with the standard bottom-up approaches.
引用
收藏
页码:4931 / 4938
页数:8
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