Laser micromachining in the microelectronics industry: A historical overview

The use of lasers in microelectronics production for trimming, ablating, drilling and general "micromachining" continues to grow. As one example, traditional laser trimming techniques for passive and active microelectronic circuits have been used for neatly thirty years to improve yields and/or device performance. The majority of these processes have been accomplished using the fundamental wavelengths of the Nd: YAG laser source. However, recent technological advances in microelectronics laser processing, mainly for hybrid integrated circuits (HIC), dynamic random access memories (DRAM) and printed wiring boards (PWB) have resulted in new process techniques. several new technologies, such as alternative wavelength processing and shaped, uniform laser spots have produced better processing quality, higher reliability, and greater yields. This paper will review the past, present and future of laser micromachining in microelectronics.