Aluminum nitride: Processing and applications

被引:129
作者
Baik, Y
Drew, RAL
机构
来源
ADVANCED CERAMIC MATERIALS: APPLICATIONS OF ADVANCED MATERIALS IN A HIGH-TECH SOCIETY I | 1996年 / 122-1卷
关键词
aluminum nitride; electronic substrates; processing; sintering; thermal management; structural applications;
D O I
10.4028/www.scientific.net/KEM.122-124.553
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Aluminum nitride is an important advanced ceramic and is becoming increasingly important as a substrate material for electronic thermal management. However there are several other potential areas of application such as liquid metal handling and for increasing the thermal conductivity of polymers. This article reviews the literature dealing with the physical and mechanical properties of AlN as well as the processing and sintering behaviour, which must be controlled in order to achieve these properties, particularly thermal conductivity. A major focus is on the applications and of AlN and some of the challenges that still face researchers and engineers prior to the full exploitation of this ceramic for commercial applications, particularly in the electronics industry.
引用
收藏
页码:553 / 570
页数:18
相关论文
共 48 条
[1]   THE THERMAL-STABILITY OF AIN [J].
ABID, A ;
BENSALEM, R ;
SEALY, BJ .
JOURNAL OF MATERIALS SCIENCE, 1986, 21 (04) :1301-1304
[2]   ALUMINUM NITRIDE BY CARBOTHERMAL NITRIDATION [J].
BACHELARD, R ;
JOUBERT, P .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1989, 109 :247-251
[3]   CARBOTHERMAL SYNTHESIS OF ALUMINUM NITRIDE USING SUCROSE [J].
BAIK, Y ;
SHANKER, K ;
MCDERMID, JR ;
DREW, RAL .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1994, 77 (08) :2165-2172
[4]  
BAIK Y, 1995, IN PRESS SINTERING 1
[5]  
BAIK Y, 1995, THESIS MCGILL U MONT
[6]  
BONNELL DA, 1991, ENG MAT HDB, V4, P879
[7]  
BOROM MP, 1972, AM CERAM SOC BULL, V51, P852
[8]   PHASE-COMPOSITION, OXYGEN-CONTENT, AND THERMAL-CONDUCTIVITY OF AIN(Y2O3) CERAMICS [J].
BUHR, H ;
MULLER, G ;
WIGGERS, H ;
ALDINGER, F ;
FOLEY, P ;
ROOSEN, A .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1991, 74 (04) :718-723
[9]  
CHANCHANI R, 1988, IEEE T COMPON HYBR, V11, P427, DOI 10.1109/33.16678
[10]  
CHIANG SK, 1988, 46 EL MICR SOC AM P, P578