Approximate analytical model for solidification in a finite PCM storage with internal fins

In latent heat storage internal heat transfer enhancement techniques such as fins have to be used because of the low heat conductivity of the phase change material. Internal heat transfer enhancement is essential, especially in a solidification process where the main heat transfer mode is conduction. The aim of this paper is to present a simplified analytical model which predicts the solid-liquid interface location and temperature distribution of the fin in the solidification process with a constant end-wall temperature in the finned two-dimensional PCM storage. The analytical results are compared to numerical results and they show that the analytical model is more suited to the prediction of the solid-liquid interface location than the temperature distribution of the fin in the PCM storage. A new factor called the fraction of solidified PCM is also introduced. The fraction of solidified PCM easily gives a good picture of how much of the storage is solidified after a given time. (C) 2003 Elsevier Science Inc. All rights reserved.