Low-power micromachined structures for gas sensors with improved robustness

被引：1

作者：

Gràcia, I ^{[1
]}

Götz, A ^{[1
]}

Plaza, JA ^{[1
]}

Cané, C ^{[1
]}

Roetsch, P ^{[1
]}

Böttner, H ^{[1
]}

Seibert, K ^{[1
]}

机构：

[1] CSIC, Ctr Nacl Microelect, E-08193 Bellaterra, Spain

来源：

MICROMACHINED DEVICES AND COMPONENTS VI | 2000年 / 4176卷

关键词：

gas sensors; micro-hotplates; anodic bonding; robustness;

D O I：

10.1117/12.395637

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Current research on microstructures for semiconductor gas sensors is on the development of low power and robust substrates. In this paper a microstructure based on the combination of micromachined silicon substrates and glass wafers is presented. This device shows high robustness and can reach high temperatures up to 700 degreesC with good power consumption. The optimisation of the design and the process fabrication is described.

引用

页码：253 / 263

页数：11

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