Thin films of polycrystalline RuO2 were deposited from bis(2, 4-dimethylpentadienyl) ruthenium, (eta(5)-2, 4-Me2C5H5)(2)Ru (1) and ruthenocene (2) on quartz and silicon substrates between 200 and 500 degrees C under Ar/O-2 or O-2. Films deposited from 1 were more adherent than those grown from 2 under the same conditions, however, none of the films were particularly adherent when O-2 was used as a carrier gas. SEM revealed a columnar structure for both precursors with grain size ranging from 0.15 - 1 5 mu. Crystallinity increased after annealing the films to 800 degrees C. Resistivity decreased as the annealing temperature increased.