Substrate pump NMOS for ESD protection applications

被引:45
作者
Duvvury, C [1 ]
Ratnaswamy, S [1 ]
Amerasekera, A [1 ]
Cline, RA [1 ]
Andresen, BH [1 ]
Gupta, V [1 ]
机构
[1] Texas Instruments Inc, Silicon Technol Dev, Dallas, TX 75265 USA
来源
ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM PROCEEDINGS, 2000 | 2000年
关键词
D O I
10.1109/EOSESD.2000.890022
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The use of a substrate pump to achieve uniform npn protection in a multi-finger NMOS is reported for advanced CMOS technologies with silicide. The novel feature of this device technique is the implementation of a floating guardring to effectively pump the local substrate of the protection NMOS. SPICE simulations are presented to illustrate the device concept as well as the device design optimization.
引用
收藏
页码:7 / 17
页数:5
相关论文
共 15 条
[1]  
AMERASEKERA A, 1995, IEDM TECH DIG
[2]  
AMERASEKERA A, 1996, IRPS P, P318
[3]  
ANDERSON W, ESD S P, P86
[4]  
CHEN J, 1997, ES S P
[5]  
CHEN KL, 1988, EOS ESD, P212
[6]  
DUVVURY C, 1992, INT REL PHY, P141, DOI 10.1109/RELPHY.1992.187639
[7]  
Duvvury C, 1995, ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM PROCEEDINGS - 1995, P162, DOI 10.1109/EOSESD.1995.478281
[8]  
DUVVURY C, 1986, IRPS P, P199
[9]   Modeling and analysis of substrate coupling in integrated circuits [J].
Gharpurey, R ;
Meyer, RG .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1996, 31 (03) :344-353
[10]  
GUPTA V, 1998, ESD S P, P170