Tungsten/copper composite deposits produced by a cold spray

被引:125
作者
Kang, HK [1 ]
Kang, SB [1 ]
机构
[1] Korea Inst Machinery & Mat, Non Ferrous Grp, Chang Won 641010, South Korea
关键词
tungsten/copper composite; cold-spray; electronic package application; COATINGS;
D O I
10.1016/j.scriptamat.2003.08.023
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
An agglomerated tungsten/copper composite powder was both cold sprayed and plasma sprayed onto a mild steel substrate for electronic package applications. Most pores resulting from the spraying were found in the vicinity of the tungsten-rich regions of the final product, The levels of porosity varied with the amount of tungsten present. No copper oxidation was found at the cold-sprayed deposit, but relatively high copper oxidation was observed at the plasma-sprayed deposit. (C) 2003 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:1169 / 1174
页数:6
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