Thin film mechanical properties through nano-indentation

Measuring material properties of sub-micron layers is an important yet a difficult task due to unavailability of proper instrumentation. Techniques such as Dynamic mechanical analysis has been used heavily in the last few years to measure modulus and glass transition temperature. But sample arrangement in this technique makes it impossible to use when thicknesses are smaller than 100 mu m. After carefull study of number of different techniques availbale in different laboratories nanoindentation was selected as one of the most suitable, hence this technique can measure mechanical properties without removing the film from the substrate and also at various points of the film. This paper discusses the modulus measurement of thin poymeric films. A possible application of this technique as an adhesion tester will also be highlighted.