A robust surface-integral-equation formulation for conductive media

被引：20

作者：

Chu, YH

Chew, WC

机构：

[1] Agilent Technol, Westlake Village, CA 91362 USA

[2] Univ Illinois, Dept Elect & Comp Engn, Everitt Lab 379, Urbana, IL 61801 USA

来源：

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2005年 / 46卷 / 02期

关键词：

conductive media; lossy media; skin depth; surface-integral-equation method;

D O I：

10.1002/mop.20916

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

A novel surface-integral-equation (SIE) formulation is proposed by timing the weighting coefficients for the external- and internal-region integral equations. Without increasing the computational cost, the present formulation significantly enlarges the solvable skin-depth range. (c) 2005 Wiley Periodicals, Inc.

引用

收藏

页码：109 / 114

页数：6

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