Contact mechanics and lubrication hydrodynamics of chemical mechanical polishing

被引：141

作者：

Tichy, J ^{[1
]}

Levert, JA

Shan, L

Danyluk, S

机构：

[1] Rensselaer Polytech Inst, Dept Mech Engn Aeronaut Engn & Mech, Troy, NY 12180 USA

[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1999年 / 146卷 / 04期

关键词：

D O I：

10.1149/1.1391798

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

A preliminary model for the contact mechanics and fluid mechanics of the chemical mechanical polishing process is presented. Only the basic equations of elastic contact surface mechanics and hydrodynamic lubrication are required. Although the model is highly idealized, no ad hoc assumptions or adjustable parameters are required. Some new experimental results are presented, reinforcing the counterintuitive experimental determination of suction fluid pressure below the pad. The model correctly predicts the magnitude of the suction pressure and the effect of load, speed and roughness. (C) 1999 The Electrochemical Society. S0013-4651(98)04-081-6. All rights reserved.

引用

页码：1523 / 1528

页数：6

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