A fully integrated 300°C, 4 kW, 3-phase, SiC motor drive module

The researchers have designed, developed, packaged, and manufactured a complete multichip power module (MCPM) that integrates silicon carbide (SiC) power transistors with silicon on insulator (SOI) control electronics. The SiC MCPM approach targets the reduction of size and the increase in efficiency of power electronic systems resulting in a highly miniaturized, high power density module. The researchers previously presented a single phase 3 kW SiC inverter that was also proven operational to 250 degrees C at 500 W. In this paper APEI, Inc. will present a new SiC three-phase inverter that has been fully tested to 4 kW at 300 degrees C operation. In this paper, the researchers discuss the challenges associated with high-temperature operation of power electronics, including the electrical, mechanical, and thermal design. Many electronic packaging problems have been solved to enable high-temperature operation of these modules. These packaging issues will be discussed as well as remaining problems that still need advancing. Finally, the full temperature and full power (300 degrees C at 4kW) test results are presented.