Copper redistribution during corrosion of aluminum alloys

被引:119
作者
Dimitrov, N [1 ]
Mann, JA
Sieradzki, K
机构
[1] Arizona State Univ, Dept Mech & Aerosp Engn, Tempe, AZ 85287 USA
[2] Arizona State Univ, Sci Engn Mat Program, Tempe, AZ 85287 USA
关键词
D O I
10.1149/1.1391570
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 [应用化学];
摘要
We describe a new quantitative electrochemical technique for measuring the copper redistribution that occurs during corrosion and pretreatment of high-strength copper-containing aluminum alloys. Underpotential deposition (upd) of Pb on Cu was used to assay the surface coverage of Cu. Model experiments using samples of known AI-Cu ratios were used to evaluate the accuracy of the technique and develop a calibration curve. The results demonstrated the accuracy of the method to within 2%. The elemental copper remaining on the surface of Al 2024-T3 samples after various pretreatment/corrosion procedures was determined using the upd technique. A simple treatment involving open-circuit etching of the alloy surface in 3 M HNO3 was found to be most efficient for the removal of Cu from the Al alloy surface. In accord with a recent observation of Bucheit et al.,(1) convection was found to enhance copper redistribution on an Al 2024-T3 Sample in 0.5 M NaCl solution. (C) 1999 The Electrochemical Society. S0013-4651(98)04-027-0. All rights reserved.
引用
收藏
页码:98 / 102
页数:5
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