Bone substitute materials such as calcium phosphate cements (CPC) are frequently used as growth factor carriers for the stimulation of osteoblast-formation around an implant. However, biological modification based on delicate protein factors like extracellular matrix proteins or growth factors is subject to a number of shortcomings like the need for storage below room temperature and cost of production. The aim of this study was to investigate ionic modification as an alternative bioinorganic route for implant modification. Although it is known that Cu(II) plays a role in angiogenesis and bone formation, not all involved processes are well understood yet. In this study the in vitro effect of Cu(II) on growth and activity of osteoblastic cells seeded on brushite (CaHPO4 center dot 2 H2O) scaffolds as well as on glass discs was investigated. The results show that Cu(II) enhances cell activity and proliferation of osteoblastic cells on CPC and furthermore affects the expression of several bone specific proteins such as bone sialo protein or osteocalcin. Therefore, the modification of CPC with Cu(II) may offer a promising alternative to protein based modification to stimulate cellular activity for an improved bone healing. (c) 2012 Wiley Periodicals, Inc. J Biomed Mater Res Part A: 100A: 23922400, 2012.
机构:
Washington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USAWashington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USA
Das, Kakoli
;
Bose, Susmita
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Washington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USAWashington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USA
Bose, Susmita
;
Bandyopadhyay, Amit
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Washington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USAWashington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USA
机构:
Washington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USAWashington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USA
Das, Kakoli
;
Bose, Susmita
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机构:
Washington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USAWashington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USA
Bose, Susmita
;
Bandyopadhyay, Amit
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h-index: 0
机构:
Washington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USAWashington State Univ, Sch Mech & Mat Engn, WM Keck Biomed Mat Res Lab, Pullman, WA 99164 USA