A 1.9-μm2 loadless CMOS four-transistor SRAM cell in a 0.18-μm logic technology

被引:11
作者
Noda, K [1 ]
Matsui, K [1 ]
Imai, K [1 ]
Inoue, K [1 ]
Tokashiki, K [1 ]
Kawamoto, H [1 ]
Yoshida, K [1 ]
Takeda, K [1 ]
Nakamura, N [1 ]
Kimura, T [1 ]
Toyoshima, H [1 ]
Koishikawa, Y [1 ]
Maruyama, S [1 ]
Saitoh, T [1 ]
Tanigawa, T [1 ]
机构
[1] NEC Corp Ltd, ULSI Device Dev Labs, Kanagawa 2291198, Japan
来源
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST | 1998年
关键词
D O I
10.1109/IEDM.1998.746440
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a loadless CMOS four-transistor cell for very high-density embedded SRAM applications. Using 0.18-mu m CMOS technology, the memory cell size is 1.9344 mu m(2) (1.04 mu m x 1.86 mu m), which is 35 % smaller than a six-transistor cell using the same design rule [1]. The newly developed CMOS 4T cell operates with high stability at 1.8 V, even though its designed cell ratio is 1.0 to minimize the area. A pair of pMOS transfer transistors is used to store and retain full-swing signals in the cell without a refresh cycle. The fabrication process is fully compatible with high performance CMOS logic technologies, because there is no need to integrate a poly-Si resistor or a TFT load.
引用
收藏
页码:643 / 646
页数:4
相关论文
共 5 条
[1]  
LYON RF, 1987, P STANF C ADV RES VL, P111
[2]   A 2.9μm2 embedded SRAM cell with Co-salicide direct-strap technology for 0.18μm high performance CMOS logic [J].
Noda, K ;
Matsui, K ;
Inoue, K ;
Itani, T ;
Iwasaki, H ;
Urabe, K ;
Miyamoto, H ;
Tokashiki, G ;
Kawamoto, H ;
Satoh, M ;
Yoshida, K ;
Kishimoto, K ;
Koyanagi, K ;
Tanigawa, T .
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, :847-850
[3]  
SAMBONSUGI Y, 1909, S VLSI TECHNOLOGY, P62
[4]  
TAKAO Y, 1997, S VLSI TECH, P11
[5]  
WOO M, 1998, S VLSI TECH, P12