Current spreading, heat transfer, and light extraction in multi-pixel LED array

被引：4

作者：

Bogdanov, M. V. ^{[2
]}

Bulashevich, K. A. ^{[2
,3
]}

Evstratov, I. Yu. ^{[2
]}

Karpov, S. Yu. ^{[1
]}

机构：

[1] STR Inc, 10404 Patterson Ave,Suite 108, Richmond, VA 23238 USA

[2] Soft Impact Ltd, St Petersburg 194156, Russia

[3] RAS, Ioffe Phys Tech Inst, St Petersburg 194021, Russia

来源：

PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 5, NO 6 | 2008年 / 5卷 / 06期

基金：

俄罗斯基础研究基金会;

关键词：

D O I：

10.1002/pssc.200778415

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Using simulation, we have investigated into the current spreading, heat transfer, and light emission in a high-power light-emitting diode (LED) with an interdigitated. multipixel. array OMPA) chip design. The main advantages of such LEDs compared with conventional square-shaped ones, like a lower series resistance and a higher emission efficiency at high currents, are interpreted in terms of current spreading and local active region overheating originated from the current crowding typical for planar LED dice.

引用

页码：2070 / +

页数：2

共 6 条

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