Modeling the thermal conductivity of diamond reinforced aluminium matrix composites with inhomogeneous interfacial conductance

被引:86
作者
Chu, Ke [1 ]
Jia, Chengchang [1 ]
Liang, Xuebing [1 ]
Chen, Hui [1 ]
Gao, Wenjia [1 ]
Guo, Hong [2 ]
机构
[1] Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China
[2] Beijing Gen Res Inst Nonferrous Met, Beijing 100088, Peoples R China
关键词
Al/diamond composites; Modeling; Thermal conductivity; Interfacial conductance;
D O I
10.1016/j.matdes.2009.04.019
中图分类号
T [工业技术];
学科分类号
120111 [工业工程];
摘要
A reasonable model for describing the thermal conductivity of diamond reinforced aluminium matrix composites behaving a distinctive character of inhomogeneous distribution of interfacial thermal conductance on diamond surfaces is proposed in terms of an equivalent diameter approach combined with a double effective-medium approximation scheme. Theoretical analyses for the thermal conductivity of diamond reinforced Al (Si) composites prepared by different infiltration techniques (squeeze casting (SQ), gas pressure infiltration (GPI)) are given for rediscovering the existing experimental results considering inhomogeneous conductance behavior. Numerical results using present model agree reasonably well with the experimental observations and explore new findings, i.e. the diffusion bonding also occurs at Al-diamond {111} interfaces of GPIed composites; the interconnected particles is possibly existed in GPled Al/diamond composites. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:4311 / 4316
页数:6
相关论文
共 20 条
[1]
THE EFFECTIVE CONDUCTIVITY OF COMPOSITES WITH IMPERFECT THERMAL CONTACT AT CONSTITUENT INTERFACES [J].
BENVENISTE, Y ;
MILOH, T .
INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE, 1986, 24 (09) :1537-1552
[2]
Mori-Tanaka models for the thermal conductivity of composites with interfacial resistance and particle size distributions [J].
Boehm, Helmut J. ;
Nogales, Sergio .
COMPOSITES SCIENCE AND TECHNOLOGY, 2008, 68 (05) :1181-1187
[3]
CHU K, 2009, J MAT DES, V30, P3497
[4]
CHU K, 2009, COMP MATER SCI, DOI DOI 10.1016/J.COMMATSCI.2009.01.01
[5]
THERMAL-CONDUCTIVITY OF METAL-MATRIX COMPOSITES [J].
DAVIS, LC ;
ARTZ, BE .
JOURNAL OF APPLIED PHYSICS, 1995, 77 (10) :4954-4960
[6]
Thermal conductivity of diamond composites sintered under high pressures [J].
Ekimov, E. A. ;
Suetin, N. V. ;
Popovich, A. F. ;
Ralchenko, V. G. .
DIAMOND AND RELATED MATERIALS, 2008, 17 (4-5) :838-843
[7]
Effect of diamond shapes and associated thermal boundary resistance on thermal conductivity of diamond-based composites [J].
Flaquer, J. ;
Rios, A. ;
Martin-Meizoso, A. ;
Nogales, S. ;
Bohm, H. .
COMPUTATIONAL MATERIALS SCIENCE, 2007, 41 (02) :156-163
[8]
Grain boundary networks: Scaling laws, preferred cluster structure, and their implications for grain boundary engineering [J].
Frary, M ;
Schuh, CA .
ACTA MATERIALIA, 2005, 53 (16) :4323-4335
[9]
Gu MY, 1997, PROG NAT SCI, V7, P600
[10]
EFFECTIVE THERMAL-CONDUCTIVITY OF COMPOSITES WITH INTERFACIAL THERMAL BARRIER RESISTANCE [J].
HASSELMAN, DPH ;
JOHNSON, LF .
JOURNAL OF COMPOSITE MATERIALS, 1987, 21 (06) :508-515