Solders in electronics

被引：131

作者：

Plumbridge, WJ

机构：

[1] Materials Discipline, Open University, Walton Hall, Milton Keynes

来源：

JOURNAL OF MATERIALS SCIENCE | 1996年 / 31卷 / 10期

关键词：

D O I：

10.1007/BF00687275

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The metallurgy and mechanical behaviour of the principal solder types based on lead-tin alloys are reviewed. Particular emphasis is placed upon their performance under simulated service conditions, fatigue, creep and ageing, and life prediction. Requirements for improved and more environmentally compatible solders are explored.

引用

页码：2501 / 2514

页数：14

共 87 条

[1]

[Anonymous], 1979, CAN METALL QUART

[2]

ARROWOOD R, 1990, SOLDER MECH STATE AR, P107

[3]

BANG ER, 1975, WELDING RES S, pS377

[4]

Bernstein H., 1982, ASTM STP, P105

[5]

BERRICHE R, 1987, 3RD P C EL PACK MAT, P169

[6]

BOCE K, 1989, P 2 ADM INT EL MAT P, P264

[7]

Clatterbaugh G., 1985, P 35 ELECT COMP C WA, P60

[8]

CLECHE JP, 1988, IEPS DALL NOV, P305

[9]

Cutiongco E. C., 1990, Transactions of the ASME. Journal of Electronic Packaging, V112, P110, DOI 10.1115/1.2904350

[10]

ECKEL JF, 1957, P ASTM, V51, P745

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