Thermal stability of boron-containing phenol formaldehyde resin

被引：97

作者：

Gao, JG ^{[1
]}

Liu, YF ^{[1
]}

Yang, LT ^{[1
]}

机构：

[1] Hebei Univ, Dept Chem, Baoding 071002, Peoples R China

来源：

POLYMER DEGRADATION AND STABILITY | 1999年 / 63卷 / 01期

关键词：

D O I：

10.1016/S0141-3910(98)00056-1

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 [高分子化学与物理]; 080501 [材料物理与化学]; 081704 [应用化学];

摘要：

The boron-containing phenol-formaldehyde resin derived from phenol, formaldehyde and boric acid was synthesized. The mechanisms of synthesis and curing reactions were investigated by infrared spectroscopy and chemical analysis. The kinetics of thermal degradation and thermal stability were determined by thermal analysis. The results show that the resin has higher heat oxidation resistance than common phenol-formaldehyde resins. In addition, the fiberglass-reinforced laminate has good mechanical and electric properties. (C) 1998 Elsevier Science Ltd. All rights reserved.

引用

页码：19 / 22

页数：4