The concept of high angle wedge polishing and thickness monitoring in TEM sample preparation

被引：14

作者：

Li, H ^{[1
]}

Salamanca-Riba, L ^{[1
]}

机构：

[1] Univ Maryland, Dept Mat & Nucl Engn, College Pk, MD 20742 USA

来源：

ULTRAMICROSCOPY | 2001年 / 88卷 / 03期

关键词：

Wedge polishing;

D O I：

10.1016/S0304-3991(01)00079-1

中图分类号：

TH742 [显微镜];

学科分类号：

摘要：

The concept of high angle wedge polishing for TEM non-metal sample preparation is introduced for the first time. Also, introduced is the concept of converting lateral distance measurement into vertical thickness measurement in monitoring TEM sample thickness. Based on the Tripod polisher, Quadripod was constructed using these two concepts. Fast and reliable TEM sample preparation (mechanical polishing down to electron transparency) can be achieved using the Quadripod. In addition. Quadripod offers the ability of locating a specific area of interest. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：171 / 178

页数：8