Integration of a receiver front-end in multilayer ceramic integrated circuit (MCIC) technology

The commercial wireless industry continues to drive for size, weight and cost reduction of wireless devices while at the same time driving the performance enhancements of these devices. Significant progress has been made in the integration and size reduction of frequency processing functions in semiconductor products, but the integration of frequency selective devices that require many passive components has lagged. Efforts are underway to integrate passive components into organic printed circuit boards, but frequency selective devices, such as VCOs and filters, require higher quality (Q) components than the typical PCBs can deliver. Multilayer Ceramic Integrated Circuits (MCIC), utilizing a low temperature co-fired ceramic materials systems, has proven that high Q passive components can be integrated in this technology to form individual devices such as T/R switches and filters. While MCIC has made a dent in the size and weight reduction of wireless devices, its significant impact will occur when multiple functions are combined into the integrated circuit. Recently, the integration of a major portion of a wireless radio's receiver front-end into a single MCIC unit has been demonstrated. This circuit incorporates a T/R switch with harmonic filter, two band reject filters, one bandpass filter, an impedance matching network, bias circuitry and a low noise amplifier. The package was 500 by 500 by 90 mils and had 44 embedded passive components and 11 components mounted on its top surface. The result of this integration was a doubling of component density over previous designs.