Dependences of magnetoresistance and morphology upon the insertion of very thin magnetic layers at interfaces between magnetic and nonmagnetic layers in Co/Cu and Ni81Fe19/Cu multilayers have been investigated. The Co/Cu multilayers with inserted Fe thickness of 0.5 similar to 1.0 Angstrom have the MR ratio of about 18% more than the noninserted multilayers, and the MR ratio in the NiFe/Cu multilayers with inserted Co of thickness of 3 Angstrom was found to be significantly increased. These results can be explained by the enhanced interlayer antiferromagnetic coupling and spin-dependent scattering phenomena at the interface. Of particular interest, the ''Clustered out-growth'' in the surface morphology of these multilayers was observed.