Laser fabrication of high aspect ratio thin holes on biodegradable polymer and its application to a microneedle

被引:91
作者
Aoyagi, Seiji
Izumi, Hayato
Isono, Yuichi
Fukuda, Mitsuo
Ogawa, Hiroshi
机构
[1] Kansai Univ, Fac Engn, Dept Ind Engn, Suita, Osaka 564, Japan
[2] Lightnix Inc, Nishinomiya, Hyogo 662, Japan
[3] Technol Res Inst Osaka Prefecture, Osaka 5941157, Japan
基金
日本学术振兴会;
关键词
polymer material; polylactic acid (PLA); excimer laser processing; high aspect ratio hole; PLA microneedle;
D O I
10.1016/j.sna.2006.11.022
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 [电气工程]; 0809 [电子科学与技术];
摘要
The present paper reports the fabrication of long thin holes with a high aspect ratio of 100 (diameter: 10 mu m, depth: I mm) in biodegradable polymer material (polylactic acid, referred to herein as PLA) using a UV excimer laser. Holes having diameters of 10, 20 and 50 mu m are fabricated from the side surface of a PLA sheet, and their fabricated shapes are observed using an optical microscope. These holes are compared with holes fabricated in other polymer sheets. It is proven that a long thin hole can be fabricated in PLA material, although at a lower fabrication rate compared that for epoxy material. This laser fabrication is applied to a PLA microneedle, which is fabricated by the micromolding technique. A hole is fabricated along the centerline of the newly developed microneedle, and it is confirmed experimentally that blood plasma is taken into this hole by capillary force. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:293 / 302
页数:10
相关论文
共 19 条
[1]
Aoyagi S, 2006, PROC IEEE MICR ELECT, P450
[2]
Aoyagi S, 2005, TRANSDUCERS '05, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P1195
[3]
BARRETT DO, 2004, P ASME INT MECH ENG
[4]
Choi SO, 2005, Transducers '05, Digest of Technical Papers, Vols 1 and 2, P1513
[5]
Choi Y, 2005, Transducers '05, Digest of Technical Papers, Vols 1 and 2, P1469
[6]
Davis SP, 2003, BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P1435
[7]
Sacrificial layer process with laser-driven release for batch assembly operations [J].
Holmes, AS ;
Saidam, SM .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1998, 7 (04) :416-422
[8]
Hong GD, 2003, BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P702
[9]
KHUMPUANG S, 2005, P 22 SENS S, P25
[10]
KIM J, 2004, P ASME INT MECH ENG