Micromachined microdevices and microinstruments

被引:4
作者
MacDonald, NC
Adams, SG
Ayon, AA
Bohringer, KF
Chen, LY
Das, JH
Haronian, D
Hofmann, W
Huang, XT
Jazairy, A
Mihailovich, RE
Miller, SA
Ogo, I
Prasad, R
Reed, BW
Saif, MTA
Shaw, KA
Webb, RY
Xu, Y
机构
[1] Cornell Univ, Ithaca, NY
关键词
D O I
10.1016/0167-9317(95)00310-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Presented is a suite of microanalytical instruments for application in the fields of mechanical testing, actuator design, field emission, acceleration measurement, acoustics, optics, bipolar transistor design, and STM scanning and manipulation; all of which were fabricated using variations on two processes. Primarily the applications consist of high-aspect-ratio and bulk-micromachined single-crystal-silicon MFMs fabricated using variations on the Single Crystal Silicon Reactive Etching and Metallization process. The other set of instruments consist of surface-micromachined suspended tungsten microstructures. Highlights of the versatility that this technology offers include multiple level structure definition using the Selective Tungsten Multiple-Level Planar Process and the fabrication of self-aligned submicron aperture extraction electrodes for field emitter tips.
引用
收藏
页码:563 / 564
页数:2
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