Miniaturization of electrostatic fluid accelerators

Existing thermal-management methods for electronics do not meet the technology needs and remain a major bottleneck in the evolution of computing, sensing, and information technology. The decreasing size of microelectronic components and the resulting increasing thermal output density require novel cooling solutions. Electrostatic fluid accelerators (EFAs), also known as electrohydrodynamic ionic wind pumps, have the potential of becoming a critical element of electronic thermal-management solutions. In order to take full advantage of EFA-based thermal management, it is essential to miniaturize EFA technology. This paper demonstrates the successful operation of a tnesoscale microfabricated silicon EFA. Several cantilever structures fabricated in bulk silicon with radii of tip curvature ranging from 0.5 to 25 mu m are used as the corona electrode. The device was fabricated using the combination of deep reactive ion etching (DRIE) and reactive ion etch (RIE) microfabrication processes. Forced convection cooling is demonstrated using infrared imaging, showing a 25 degrees C surface temperature reduction over an actively heated substrate. The fabrication and test results of a mesoscale microfabricated EFA are presented in this paper.