Intersonic crack growth in bimaterial interfaces: An investigation of crack face contact

被引：41

作者：

Huang, Y ^{[1
]}

Wang, W

Liu, C

Rosakis, AJ

机构：

[1] Univ Illinois, Dept Mech & Ind Engn, Urbana, IL 61801 USA

[2] Univ Calif Los Alamos Natl Lab, Div Mat Sci & Technol, Los Alamos, NM 87545 USA

[3] CALTECH, Grad Aeronaut Labs, Pasadena, CA 91125 USA

[4] CASE Tech Ctr, Dept Engn Anal, Burr Ridge, IL 60521 USA

来源：

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS | 1998年 / 46卷 / 11期

基金：

美国国家科学基金会;

关键词：

intersonic crack growth; bimaterial interface; crack face contact;

D O I：

10.1016/S0022-5096(98)00003-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Steady-state intersonic interfacial crack growth accounting for crack face contact is analyzed. The results clearly predict the essential features of experimental observations based on two different but complementary optical techniques and high speed photography. The solution features a large scale contact zone and two distinct traveling shock waves, one emanating from the crack tip and the other from the end of the contact zone. In addition, the solution predicts a non-zero energy dissipation rate due to crack face contact. (C) 1998 Elsevier Science Ltd. All rights reserved.

引用

页码：2233 / 2259

页数：27

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