Miniature loop heat pipes - A promising means for cooling electronics

被引：134

作者：

Maydanik, YF ^{[1
]}

Vershinin, SV

Korukov, MA

Ochterbeck, JM

机构：

[1] Russian Acad Sci, Ural Branch, Inst Thermal Phys, Ekaterinburg 620016, Russia

[2] Clemson Univ, Dept Engn Mech, Clemson, SC 29634 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2005年 / 28卷 / 02期

关键词：

computer CPU cooling; heat-transfer device; loop heat pipe (LHP); thermal resistance;

D O I：

10.1109/TCAPT.2005.848487

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

Loop heat pipes (LHPs) are highly efficient heat-transfer devices, which have considerable advantages over conventional heat pipes. Currently, miniature LHPs (MLHPs) with masses ranging from 10-20 g and ammonia and water as working fluids have been developed and tested. The MLHPs are capable of transferring heat loads of 100-200 W for distances up to 300 mm in the temperature range 50-100 degrees C at any orientation in 1-g conditions. The thermal resistance for these conditions are in the range from 0.1 to 0.2 K/W. The devices possess mechanical flexibility and are adaptable to different conditions of location and operation. Such characteristics of MLHPs open numerous prospects for use in cooling systems of electronics and computer systems.

引用

页码：290 / 296

页数：7

共 11 条

[1]

Dunn P. D., 1976, HEAT PIPES

[2]

Goncharov K., 2002, P 12 INT HEAT PIP C, P171

[3]

MAEZAWA K, 1999, P 11 INT HEAT PIP C, P469

[4]

MAYDANIK Y, 2003, P 7 INT HEAT PIP S J, P45

[5]

Maydanik Y., 1989, LOOP HEAT PIPES DEV

[6]

MAYDANIK YF, 1985, Patent No. 4515209

[7]

MAYDANIK YF, 1996, P 5 INT HEAT PIP S M, P406

[8]

MOCHIZUKI M, 1996, P 5 INT HEAT PIP S M, P218

[9]

Miniature loop heat pipes for electronics cooling [J].

Pastukhov, VG ;

Maidanik, YF ;

Vershinin, CV ;

Korukov, MA .

APPLIED THERMAL ENGINEERING, 2003, 23 (09) :1125-1135

[10]

PASTUKHOV VG, 1997, P 6 EUR S SPAC ENV C, P385

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