Shock and vibration of solder bumped flip chip on organic coated copper boards

被引：22

作者：

Lau, J ^{[1
]}

Schneider, E ^{[1
]}

Baker, T ^{[1
]}

机构：

[1] HEWLETT PACKARD CORP, BOISE, ID 83714 USA

来源：

JOURNAL OF ELECTRONIC PACKAGING | 1996年 / 118卷 / 02期

关键词：

D O I：

10.1115/1.2792127

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different chip sizes (7 mm and 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. However, for the out-of-plane vibration tests all the chips were underfilled with epoxy.

引用

页码：101 / 104

页数：4

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