Stamp collapse in soft lithography

被引：189

作者：

Huang, YGY ^{[1
]}

Zhou, WX

Hsia, KJ

Menard, E

Park, JU

Rogers, JA

Alleyne, AG

机构：

[1] Univ Illinois, Dept Mech & Ind Engn, Urbana, IL 61801 USA

[2] Univ Illinois, Dept Theoret & Appl Mech, Urbana, IL 61801 USA

[3] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA

[4] Univ Paris 06, UMR 7611, Chim Organ Lab, F-75252 Paris, France

来源：

LANGMUIR | 2005年 / 21卷 / 17期

关键词：

D O I：

10.1021/la0502185

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

引用

页码：8058 / 8068

页数：11

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