Filament architectures in AC conductors:: the influence of intergrowths

被引：7

作者：

Everett, J

Perkins, G

Volkozub, AV

Caplin, AD

Dhallé, M

Polcari, A

Marti, F

Huang, YB

Flükiger, R

机构：

[1] Univ London Imperial Coll Sci Technol & Med, Blackett Lab, London SW7 2BZ, England

[2] Univ Geneva, Dept Phys Mat Condensee, CH-1211 Geneva 4, Switzerland

来源：

PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS | 1998年 / 310卷 / 1-4期

基金：

英国工程与自然科学研究理事会;

关键词：

Bi-2223; tape; intergrowth; magnetization; coupling;

D O I：

10.1016/S0921-4534(98)00462-6

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Filament isolation is an extremely important factor in multi-filamentary conductors, and attempts have been made to achieve this by incorporating a resistive oxide sheath around individual filaments. However, filament-bridging intergrowths have been observed in conductors with and without the resistive sheath. We present magnetisation results on BSCCO-2223/Ag conductors with different filament configurations, and analyse the data taking into account the effects of magnetic coupling between filaments. All samples studied display some degree of filament bridging. (C) 1998 Published by Elsevier Science B.V. All rights reserved.

引用

页码：202 / 207

页数：6

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