Uncooled focal plane array detector development at InfraredVision technology corporation

被引：4

作者：

Hay, KA ^{[1
]}

Van Deusen, D ^{[1
]}

Liu, TY ^{[1
]}

Kleinhans, WA ^{[1
]}

机构：

[1] InfraredVis Technol Corp, Buellton, CA 93427 USA

来源：

INFRARED TECHNOLOLGY AND APPLICATIONS XXIX | 2003年 / 5074卷

关键词：

UFPA; uncooled; microbolometer; VOx; vanadium oxide; readout integrated circuit (ROIC);

D O I：

10.1117/12.487455

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

InfraredVision Technology Corporation ("ITC") has developed a low-cost Uncooled Focal Plane Array ("UFPA") for commercial applications. The ITC-1000 series detector module has been targeted for both imaging and radiometric camera applications. The 320x240 VOx microbolometer-based sensor exploits a 37.5-mum pixel structure to provide potential cost reduction for the camera manufacturers. The CMOS Readout Integrated Circuit ("ROIC") design offers on-chip nortuniformity correction capability and gain control. As an additional feature, the design allows non-temperature stabilized operation. The integration time can be varied for applications where large variations in infrared radiation must be accommodated. Vacuum packaging of the sensors is accomplished using low-cost metal design. A radiometric version of this detector, the ITC-1100, has also been developed for thermographic applications.

引用

页码：491 / 499

页数：9