Positive-tone wafer coating materials evaluation on lithography process

被引：4

作者：

Huang, DF ^{[1
]}

Chiou, JY ^{[1
]}

Hung, CC ^{[1
]}

Young, BR ^{[1
]}

机构：

[1] Taiwan Semiconductor Mfg Co, Hsing Chu, Taiwan

来源：

INTEGRATED OPTICS DEVICES V | 2001年 / 4277卷

关键词：

positive; polyimide; PBO;

D O I：

10.1117/12.426818

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

The polyimide technology has been used extensively for semiconductor industry, includes buffer coating, interlayer dielectric and passivation, Alpha ray shielding and protective/ insulating films. The features of the polyimide material for the new generation of advanced semiconductor products must have excellent properties and high performances to meet various demands in the Microelectronics application. The requirements include high resolution, low internal stress, process cost reduction, environment safety, excellent process stability and window in the future. Three kinds of heat-resistant base polymers had been widely applied on wafer-coating process in microelectronic device including polyamic acids, ring-closure type soluble Polyimides with hydroxyl groups, and PBO (Polybenzoxazole) precursors. In this work,we had evaluated positive-tone photosensitivity with Aqueous developable (TMAH) polyimide consisting of previous base resins, and compared the difference of process conditions, cured-film properties, adhesion properties, etching recipes as one mask process and reliability test, etc.

引用

页码：375 / 380

页数：6