In the first part of this paper, we review the integration of MEMS and CMOS microtransducer technology and outline the related IC MEMS CAD tools SOLIDIS and ICMAT. The IC microtransducer approach is illustrated by deflectable micromirrors, infrared sensors, and a thermally isolated n-well CMOS device. In the second part, we report two novel chemical microsensors based on CMOS MEMS technology: (i) a piezoresistive resonating beam with hydrocarbon-sensitive polymer layer and (ii) a microsystem chip including piezoresistive and capacitive chemical sensors with co-integrated heating device and circuitry.